Sign In | Join Free | My ecer.co.uk
China Shenzhen Xunsiwei Circuit Co., Ltd. logo
Shenzhen Xunsiwei Circuit Co., Ltd.
Verified Supplier

1 Years

Home > Communication PCB >

High Precision 8 Layer ENIG PCB Circuit Board Assembly Services For Industrial Control

Shenzhen Xunsiwei Circuit Co., Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

High Precision 8 Layer ENIG PCB Circuit Board Assembly Services For Industrial Control

Model Number : XSWPCB

Material : FR4 TG150

Delivery Time : 8-15DAYS

Minimum Hole Size : 0.2

Brand Name : XSW PCB

Supply Ability : 1 Million Square feet/per month

Board Thickness : 1.6mm

Copper Thickness : 1/1/1/1 oz

Payment Terms : Western Union

Certification : UL ,IOS9000

Place of Origin : China

MOQ : 1

Minimum Line Width : 0.1mm

Layer Count : 8 L

Price : Negotiable

Contact Now

8-layer ENIG Black Base Station Equipment Board
This high-performance 8-layer PCB features a 1.6mm board thickness using TG150 material with blue solder mask. The surface finish is ENIG (Electroless Nickel Immersion Gold), with precise trace width/spacing of 0.1mm, inner layer copper thickness of 0.5oz, and outer layer copper thickness of 1.0oz.
Key Specifications
Layer Count 8 Layers
Material FR4 TG150
Board Thickness 1.6mm
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.2mm
Minimum Line Width 0.1mm
Minimum Line Spacing 0.1mm
Solder Mask Color Blue
Surface Finish ENIG
Application Field Industrial Control
Critical Production Processes
  • Inner layer core board target punching accuracy: ±25μm
  • Hot melt riveting fixation to prevent board sliding during lamination
  • LDI exposure equipment for inner layer pattern transfer with increased exposure energy compensation for fine line areas
  • 100% AOI inspection and line width measurement after inner layer etching
  • Low-flow prepreg lamination process with temperature ramp rate maintained between 1.5-2.0°C/min
  • Scanning acoustic microscopy for delamination and void defect detection
  • Coated drill bits with optimized retract speed to reduce burrs
  • Plasma treatment before electroless copper deposition for improved hole wall adhesion
  • V-cut or routing processes for final shaping to prevent fiberglass burrs
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Product Tags:

High Precision PCB Circuit Board

      

ENIG PCB Circuit Board

      

8 Layer Circuit Board Assembly Services

      
Quality High Precision 8 Layer ENIG PCB Circuit Board Assembly Services For Industrial Control for sale

High Precision 8 Layer ENIG PCB Circuit Board Assembly Services For Industrial Control Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Xunsiwei Circuit Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)